This term refers to a specific method of packaging integrated circuits. It describes a standardized format where the microchip is encased in a rectangular housing with two parallel rows of electrical connector pins extending along its length. This construction allows for easy insertion into sockets or through-hole soldering onto printed circuit boards.
This packaging approach offers a balance of size, cost, and ease of use, making it a popular choice for a wide range of electronic devices. Its widespread adoption historically facilitated mass production and simplified circuit board design, contributing significantly to the development of modern electronics by enabling compact and reliable integration of electronic components. This standardization promoted compatibility and reduced manufacturing costs.
